SELECTIVE ELECTROLESS METAL-DEPOSITION FOR INTEGRATED-CIRCUIT FABRICATION

被引:108
作者
TING, CH
PAUNOVIC, M
机构
关键词
D O I
10.1149/1.2096654
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:456 / 462
页数:7
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共 22 条
[1]  
ARNOLD AF, 1974, Patent No. 3857733
[2]  
BLEWER RS, 1986, P WORKSHOP TUNGSTEN
[3]  
Brown D. M., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P66
[4]   ELECTROLESS GOLD PLATING ON III-V COMPOUND-CRYSTALS [J].
DASARO, LA ;
NAKAHARA, S ;
OKINAKA, Y .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (09) :1935-1940
[5]  
Green M., 1987, ENGLISH CULTURAL STU, P1
[6]   THE CHARACTERIZATION OF VIA-FILLING TECHNOLOGY WITH ELECTROLESS PLATING METHOD [J].
HARADA, Y ;
FUSHIMI, K ;
MADOKORO, S ;
SAWAI, H ;
USHIO, S .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (11) :2428-2430
[7]   SINGLE-STEP OPTICAL LIFT-OFF PROCESS [J].
HATZAKIS, M ;
CANAVELLO, BJ ;
SHAW, JM .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (04) :452-460
[8]  
Hey H. P. W., 1986, International Electron Devices Meeting 1986. Technical Digest (Cat. No.86CH2381-2), P50
[9]   COPPER POLYIMIDE MATERIALS SYSTEM FOR HIGH-PERFORMANCE PACKAGING [J].
JENSEN, RJ ;
CUMMINGS, JP ;
VORA, H .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1984, 7 (04) :384-393
[10]   EFFECTS OF MOS METALLIZATION GEOMETRY AND PROCESSING ON MOBILE IMPURITIES [J].
LEARN, AJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (08) :1127-1132