256-MB DRAM CIRCUIT TECHNOLOGIES FOR FILE APPLICATIONS

被引:21
作者
KITSUKAWA, G
HORIGUCHI, M
KAWAJIRI, Y
KAWAHARA, T
AKIBA, T
KAWASE, Y
TACHIBANA, T
SAKAI, T
AOKI, M
SHUKURI, S
SAGARA, K
NAGAI, R
OHJI, Y
HASEGAWA, N
YOKOYAMA, N
KISU, T
YAMASHITA, H
KURE, T
NISHIDA, T
机构
[1] HITACHI LTD,DIV SEMICOND & INTEGRATED CIRCUITS,KODAIRA,TOKYO 187,JAPAN
[2] HITACHI DEVICE ENGN CO LTD,MOBARA,CHIBA 297,JAPAN
[3] HITACHI VLSI ENGN CORP LTD,KODAIRA,TOKYO 187,JAPAN
关键词
D O I
10.1109/4.245589
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
256-Mb DRAM circuit technologies characterized by low power and high fabrication yield for file applications are described. The newly proposed and developed circuits are a self-reverse-biasing circuit for word drivers and decoders to suppress the subthreshold current to 3% of the conventional scheme, and a subarray-replacement redundancy technique that doubles chip yield and consequently reduces manufacturing costs. An experimental 256-Mb DRAM has been designed and fabricated by combining the proposed circuit techniques and a 0.25-mu m phase-shift optical lithography, and its basic operations are verified. A 0.72-mu m(2) double-cylindrical recessed stacked-capacitor (RSTC) cell is used to ensure a storage capacitance of 25 fF/cell. A typical access time under a 2-V power supply voltage was 70 ns. With the proper device characteristics, the simulated performances of the 256-Mb DRAM operating with a 1.5-V power supply voltage are a data-retention current of 53 mu A and an access time of 48 ns.
引用
收藏
页码:1105 / 1113
页数:9
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