THE THERMAL-EXPANSION COEFFICIENT OF AIIIBV MULTILAYER STRUCTURE

被引：6

作者：

BAKMISIUK, J

WOLF, J

PIETSCH, U

机构：

[1] UNIV JENA,SEKT PHYS,O-6900 JENA,GERMANY

[2] KARL MARX UNIV,SEKT PHYS,O-7010 LEIPZIG,GERMANY

来源：

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 1990年 / 118卷 / 01期

关键词：

D O I：

10.1002/pssa.2211180125

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The anisotropy of the thermal expansion coefficient (TEC) of thin multilayers is determined by measuring the temperature dependence of the lattice mismatch with respect to the substrate. The TEC of the substrate is determined by the Bond method. The elastic strain and the TEC of 8 to 90 nm thin sandwiched layers can be explained as for single layers having thickness of a few micrometer. An influence of the elastic interaction through the interfaces on the TEC is not noticeable. Copyright © 1990 WILEY‐VCH Verlag GmbH & Co. KGaA

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页码：209 / 217

页数：9

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