ELECTROMIGRATION AND SPATIAL VARIATIONS IN METALLIC CONDUCTIVITY

被引：6

作者：

LANDAUER, R ^{[1
]}

机构：

[1] IBM CORP, THOMAS J WATSON RES CTR, YORKTOWN HTS, NY 10598 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1975年 / 4卷 / 05期

关键词：

D O I：

10.1007/BF02660174

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：813 / 821

页数：9

共 19 条

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[9] SPATIAL VARIATION OF CURRENTS AND FIELDS DUE TO LOCALIZED SCATTERERS IN METALLIC CONDUCTION [J].

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[10] SPATIAL CONDUCTIVITY MODULATION AT METALLIC POINT-DEFECTS [J].

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