ORIGIN OF INTRINSIC STRESS IN Y2O3 FILMS DEPOSITED BY REACTIVE SPUTTERING

被引:23
作者
CHOI, HM
CHOI, SK
机构
[1] Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, Kusung-dong Yusung-gu Dae-Jeon
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1995年 / 13卷 / 06期
关键词
D O I
10.1116/1.579713
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Y2O3 thin films were deposited by reactive sputtering of an Y target in an Ar and O-2 gas mixture. Intrinsic stresses and the Ar content in the films were measured by the sine square psi method of x-ray diffraction and wavelength dispersive spectrometer, respectively. At low working pressures the films had high compressive stresses. As working pressure increased, compressive stress was relaxed. Ar content was high in the film that had high compressive stress. After annealing of the films at 700 degrees C, the compressive stress was largely relaxed but the Ar content remained unchanged. These results clearly showed that compressive stress in Y2O3 films was not caused by Ar entrapment as an impurity but by Ar bombardment. Intrinsic stress was almost independent of the O-2/Ar flow ratio. showing that O bombardment was equal to Ar bombardment in affecting the intrinsic stress in Y2O3 films. The independence of intrinsic stress with the O-2/Ar flow ratio was explained by the concept of M(i)(1/2){[M(i) cos theta+/-(M(t)(2) - M(i)(2) sin(2) theta)(1/2)]/(M(i) + M(t))} instead of the M(i)/M(i) ratio, where M(t) is the atomic mass of the target material, M(i) is the atomic mass of the sputtering gas, and theta is the scattering angle. (C) 1995 American Vacuum Society.
引用
收藏
页码:2832 / 2835
页数:4
相关论文
共 26 条
[1]  
Bunshah R. F., 1982, DEPOSITION TECHNOLOG
[2]   NOTE ON THE ORIGIN OF INTRINSIC STRESSES IN FILMS DEPOSITED VIA EVAPORATION AND SPUTTERING [J].
DHEURLE, FM ;
HARPER, JME .
THIN SOLID FILMS, 1989, 171 (01) :81-92
[3]   A SIMPLE REPRESENTATION FOR THE ANGULAR-DEPENDENCE OF SCATTERED AND RECOIL PARTICLE ENERGIES [J].
ECKSTEIN, W ;
BASTASZ, R .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1988, 29 (04) :603-608
[4]   STRUCTURE AND PROPERTIES OF TITANIUM NITRIDE THIN-FILMS DEPOSITED AT LOW-TEMPERATURES USING DIRECT-CURRENT MAGNETRON SPUTTERING [J].
ELSTNER, F ;
EHRLICH, A ;
GIEGENGACK, H ;
KUPFER, H ;
RICHTER, F .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (02) :476-483
[5]   STRESS-CONTROL IN REACTIVELY SPUTTERED AIN AND TIN FILMS [J].
ESTE, G ;
WESTWOOD, WD .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (04) :1892-1897
[6]   INTERNAL-STRESSES IN SPUTTERED CHROMIUM [J].
HOFFMAN, DW ;
THORNTON, JA .
THIN SOLID FILMS, 1977, 40 (JAN) :355-363
[7]   COMPRESSIVE STRESS TRANSITION IN AL, V, ZR, NB AND W METAL-FILMS SPUTTERED AT LOW WORKING PRESSURES [J].
HOFFMAN, DW ;
THORNTON, JA .
THIN SOLID FILMS, 1977, 45 (02) :387-396
[8]   INTERNAL-STRESSES IN CR, MO, TA, AND PT FILMS DEPOSITED BY SPUTTERING FROM A PLANAR MAGNETRON SOURCE [J].
HOFFMAN, DW ;
THORNTON, JA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (03) :355-358
[9]   STRESS DEPENDENCE OF REACTIVELY SPUTTERED ALUMINUM NITRIDE THIN-FILMS ON SPUTTERING PARAMETERS [J].
HUFFMAN, GL ;
FAHNLINE, DE ;
MESSIER, R ;
PILIONE, LJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03) :2252-2255
[10]   RESIDUAL-STRESSES AND FRACTURE PROPERTIES OF MAGNETRON-SPUTTERED TI FILMS ON SI MICROELEMENTS [J].
LJUNGCRANTZ, H ;
HULTMAN, L ;
SUNDGREN, JE ;
JOHANSSON, S ;
KRISTENSEN, N ;
SCHWEITZ, JA ;
SHUTE, CJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (03) :543-553