共 26 条
[1]
Bunshah R. F., 1982, DEPOSITION TECHNOLOG
[4]
STRUCTURE AND PROPERTIES OF TITANIUM NITRIDE THIN-FILMS DEPOSITED AT LOW-TEMPERATURES USING DIRECT-CURRENT MAGNETRON SPUTTERING
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1994, 12 (02)
:476-483
[5]
STRESS-CONTROL IN REACTIVELY SPUTTERED AIN AND TIN FILMS
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1987, 5 (04)
:1892-1897
[8]
INTERNAL-STRESSES IN CR, MO, TA, AND PT FILMS DEPOSITED BY SPUTTERING FROM A PLANAR MAGNETRON SOURCE
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY,
1982, 20 (03)
:355-358
[9]
STRESS DEPENDENCE OF REACTIVELY SPUTTERED ALUMINUM NITRIDE THIN-FILMS ON SPUTTERING PARAMETERS
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1989, 7 (03)
:2252-2255
[10]
RESIDUAL-STRESSES AND FRACTURE PROPERTIES OF MAGNETRON-SPUTTERED TI FILMS ON SI MICROELEMENTS
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS,
1993, 11 (03)
:543-553