SHALLOW JUNCTIONS BY ION-IMPLANTATION AND RAPID THERMAL ANNEALING

被引:25
作者
HILL, C
机构
关键词
D O I
10.1016/S0168-583X(87)80071-X
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
引用
收藏
页码:348 / 358
页数:11
相关论文
共 34 条
[21]  
KALISH R, 1983, APPL PHYS LETT, V43, P957
[22]   CHANNEL ION-IMPLANTATION FOR SMALL-GEOMETRY HIGH-PERFORMANCE CMOS-SOS CIRCUITS [J].
LEWIS, AG ;
BRASSINGTON, MP ;
PARTRIDGE, SL .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1986, 33 (03) :335-344
[23]   CHANNELING EFFECT OF LOW-ENERGY BORON IMPLANT IN (100) SILICON [J].
LIU, TM ;
OLDHAM, WG .
IEEE ELECTRON DEVICE LETTERS, 1983, 4 (03) :59-62
[24]   RAPID ELECTRON-BEAM ISOTHERMAL PROCESSING OF ARSENIC-IMPLANTED NMOS DEVICES [J].
MCMAHON, RA ;
AHMED, H ;
GODFREY, D ;
YALLUP, KJ .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (11) :1550-1555
[25]   EFFECTS OF GRAIN-BOUNDARIES ON LASER CRYSTALLIZED POLY-SI MOSFETS [J].
NG, KK ;
CELLER, GK ;
POVILONIS, EI ;
FRYE, RC ;
LEAMY, HJ ;
SZE, SM .
ELECTRON DEVICE LETTERS, 1981, 2 (12) :316-318
[26]   TRANSIENT-ENHANCED DIFFUSION DURING FURNACE AND RAPID THERMAL ANNEALING OF ION-IMPLANTED SILICON [J].
PENNYCOOK, SJ ;
NARAYAN, J ;
HOLLAND, OW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (08) :1962-1968
[27]  
PENSL S, 1984, ENERGY BEAM SOLID IN, P347
[28]  
Sadana D. K., 1985, Microscopy of Semiconducting Materials, 1985. Proceedings of the Royal Microscopical Society Conference, P93
[29]  
Sedgwick T. O., 1984, VLSI Science and Technology-1984. Proceedings of the Second International Symposium on Very Large Scale Integration Science and Technology. Materials for High Speed/High Density Applications, P192
[30]  
Seidel T. E., 1985, Energy Beam-Solid Interactions and Transient Thermal Processing/1984 Symposium, P329