CORRELATION OF DYNAMIC FRICTION AND THE DISLOCATION ETCH PIT DENSITY SURROUNDING ANNEALED SCRATCHES IN (111) P-TYPE SILICON

被引:5
作者
LIM, DS [1 ]
DANYLUK, S [1 ]
机构
[1] UNIV ILLINOIS,DEPT CIVIL ENGN MECH & MET,CHICAGO,IL 60680
关键词
Crystals;
D O I
10.1007/BF01111922
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The dynamic friction coefficient between a 90° pyramid diamond and a (111) p-type silicon single crystal has been measured for linear, unidirectional scratches made in the [110] direction in laboratory air, deionized water and ethanol. Scanning electron microscopy showed that the groove morphology depended on the fluid in contact with the surface during the scratch test. The grooves formed after ten scratches were annealed to 750°C for 3600 sec and etch pits were measured as a function of distance from the groove wall. The etch pit density and their distance from the groove wall was related to the type of fluid used in the scratch test: the density was highest and the distance from the groove wall largest for the groove formed in air and lowest for the groove formed in ethanol. These results imply that the deformation mode and the magnitude of the residual stresses surrounding the groove depend on the environmental conditions during the scratch test. The friction coefficient was found to vary linearly with the average etch pit density.
引用
收藏
页码:2607 / 2612
页数:6
相关论文
共 11 条
  • [1] Chen C. P., 1981, Fifteenth IEEE Photovoltaic Specialists Conference - 1981, P1122
  • [2] MINIMUM SILICON-WAFER THICKNESS FOR ID WAFERING
    CHEN, CP
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (12) : 2835 - 2837
  • [3] THE WEAR RATE OF N-TYPE SI(100)
    DANYLUK, S
    CLARK, JL
    [J]. WEAR, 1985, 103 (02) : 149 - 159
  • [4] EVANS AG, 1979, NBS SPECIAL PUBLICAT, V562
  • [5] EFFECT OF LUBRICANT ENVIRONMENTS ON SAW DAMAGE IN SI WAFERS
    KUAN, TS
    SHIH, KK
    VANVECHTEN, JA
    WESTDORP, WA
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1980, 127 (06) : 1387 - 1394
  • [6] LEE SW, 1986, THESIS U ILLINOIS CH
  • [7] LIM D, IN PRESS
  • [8] SURFACE DAMAGE OF SINGLE-CRYSTAL SILICON ABRADED IN ETHANOL AND DEIONIZED WATER
    LIM, DS
    DANYLUK, S
    [J]. JOURNAL OF MATERIALS SCIENCE, 1985, 20 (11) : 4084 - 4090
  • [9] ID-DIAMOND-SAWING DAMAGE TO GERMANIUM AND SILICON
    MEEK, RL
    HUFFSTUTLER, MC
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1969, 116 (06) : 893 - +
  • [10] SOPER RB, 1970, NBS SPEC PUBL, V337, P412