LIMITATION OF TI/TIN DIFFUSION BARRIER LAYERS IN SILICON TECHNOLOGY

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J]. THIN SOLID FILMS, 1983, 107 (01) : 45 - 54

[2] ANTONIADIS DA, 1978, SEL78011 STANF REP

[3] MODELS FOR CONTACTS TO PLANAR DEVICES [J]. SOLID-STATE ELECTRONICS, 1972, 15 (02) : 145 - &

[4] SPECIFIC CONTACT RESISTANCE OF METAL-SEMICONDUCTOR BARRIERS [J]. SOLID-STATE ELECTRONICS, 1971, 14 (07) : 541 - &

[5] DUFFIN WJ, 1954, ACTA CRYSTALLOGR, V17, P450

[6] TITANIUM NITRIDE AS A DIFFUSION BARRIER BETWEEN NICKEL SILICIDE AND ALUMINUM [J]. JOURNAL OF ELECTRONIC MATERIALS, 1984, 13 (02) : 327 - 340

[7] FOURNIER PR, 1975, Patent No. 3879746

[8] FOURNIER PR, 1974, Patent No. 3798145

[9] TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J]. THIN SOLID FILMS, 1979, 60 (02) : 237 - 247

[10] ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 81 - 87

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J]. THIN SOLID FILMS, 1983, 107 (01) : 45 - 54

[2] ANTONIADIS DA, 1978, SEL78011 STANF REP

[3] MODELS FOR CONTACTS TO PLANAR DEVICES [J]. SOLID-STATE ELECTRONICS, 1972, 15 (02) : 145 - &

[4] SPECIFIC CONTACT RESISTANCE OF METAL-SEMICONDUCTOR BARRIERS [J]. SOLID-STATE ELECTRONICS, 1971, 14 (07) : 541 - &

[5] DUFFIN WJ, 1954, ACTA CRYSTALLOGR, V17, P450

[6] TITANIUM NITRIDE AS A DIFFUSION BARRIER BETWEEN NICKEL SILICIDE AND ALUMINUM [J]. JOURNAL OF ELECTRONIC MATERIALS, 1984, 13 (02) : 327 - 340

[7] FOURNIER PR, 1975, Patent No. 3879746

[8] FOURNIER PR, 1974, Patent No. 3798145

[9] TIN AS A DIFFUSION BARRIER IN THE TI-PT-AU BEAM-LEAD METAL SYSTEM [J]. THIN SOLID FILMS, 1979, 60 (02) : 237 - 247

[10] ZRN DIFFUSION BARRIER IN ALUMINUM METALLIZATION SCHEMES [J]. THIN SOLID FILMS, 1983, 104 (1-2) : 81 - 87