PASSIVATION AND MASKLESS PROCESSING WITH ANISOTROPIC ETCHES IN SILICON

被引:5
作者
DAY, DJ
MIDDLETON, GWR
JANES, TW
WHITE, JC
MIFSUD, VJ
机构
关键词
D O I
10.1149/1.2115595
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
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页码:407 / 410
页数:4
相关论文
共 10 条
[1]   ANISOTROPIC ETCHING OF SILICON [J].
BEAN, KE .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1978, 25 (10) :1185-1193
[2]  
BOGH A, 1971, J ELECTROCHEM SOC, V118, P401
[3]   PREPARATION OF LARGE-AREA MONO-CRYSTALLINE SILICON THIN WINDOWS [J].
CHEUNG, NW .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1980, 51 (09) :1212-1216
[4]  
DAY DJ, UNPUB J PHYS D
[5]   THE ROLE OF SURFACE IRREGULARITIES (STEPS, KINKS) AND POINT-DEFECTS ON THE CHEMICAL-REACTIVITY OF SOLID-SURFACES [J].
FERRER, S ;
ROJO, JM ;
SALMERON, M ;
SOMORJAI, GA .
PHILOSOPHICAL MAGAZINE A-PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS AND MECHANICAL PROPERTIES, 1982, 45 (02) :261-269
[6]  
JANES TW, 1982, ESSDERC
[7]   STUDY OF THE ETCH-STOP MECHANISM IN SILICON [J].
PALIK, ED ;
FAUST, JW ;
GRAY, HF ;
GREENE, RF .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (09) :2051-2059
[8]   SILICON AS A MECHANICAL MATERIAL [J].
PETERSEN, KE .
PROCEEDINGS OF THE IEEE, 1982, 70 (05) :420-457
[9]   ELECTROCHEMICALLY CONTROLLED THINNING OF SILICON [J].
WAGGENER, HA .
BELL SYSTEM TECHNICAL JOURNAL, 1970, 49 (03) :473-+
[10]  
1982, Patent No. 8235658