OPTICAL-PROPERTIES OF TITANIUM NITRIDE THIN-FILMS

被引:10
作者
TOMPKINS, HG [1 ]
GREGORY, R [1 ]
BOECK, B [1 ]
机构
[1] MOTOROLA INC, AUSTIN, TX 78721 USA
关键词
D O I
10.1002/sia.740170107
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Titanium nitride films were deposited using various process parameters. The film stoichiometry and the optical properties were then measured for all of the films. As expected, the stoichiometry is affected by the deposition rate and composition of the gas phase. We show that the index of refraction is affected by the substrate temperature as well as by the stoichiometry. We also show that as long as the amount of nitrogen in the film is above a critical value, the film is nitride-like. When the amount of nitrogen in the film drops below a critical value, the index of refraction is more characteristic of metallic titanium than titanium nitride.
引用
收藏
页码:22 / 24
页数:3
相关论文
共 15 条
[1]   ANALYTICAL ELECTRON-MICROSCOPY OF AL/TIN CONTACTS ON SILICON FOR APPLICATIONS TO VERY LARGE-SCALE INTEGRATED DEVICES [J].
ARMIGLIATO, A ;
VALDRE, G .
JOURNAL OF APPLIED PHYSICS, 1987, 61 (01) :390-396
[2]  
DINTNER H, 1989, THIN SOLID FILMS, V182, P237, DOI 10.1016/0040-6090(89)90259-9
[3]  
ERNSBERGER C, 1986, J VAC SCI TECHNOL A, V4, P278
[5]   TIW NITRIDE THERMALLY STABLE SCHOTTKY CONTACTS TO GAAS - CHARACTERIZATION AND APPLICATION TO SELF-ALIGNED GATE FIELD-EFFECT TRANSISTOR FABRICATION [J].
GEISSBERGER, AE ;
SADLER, RA ;
BALZAN, ML ;
CRITES, JW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (06) :1701-1706
[6]  
HARRA DJ, 1989, SEMICONDUCTOR IN DEC, P96
[7]   ADVANCED METALLIZATION OF VERY-LARGE-SCALE INTEGRATION DEVICES [J].
JOSWIG, H ;
KOHLHASE, A ;
KUCHER, P .
THIN SOLID FILMS, 1989, 175 :17-22
[8]   INVESTIGATION OF REACTIVELY SPUTTERED TIN FILMS FOR DIFFUSION-BARRIERS [J].
KANAMORI, S .
THIN SOLID FILMS, 1986, 136 (02) :195-214
[9]   TRANSMISSION ELECTRON-MICROSCOPY STUDIES OF BROWN AND GOLDEN TITANIUM NITRIDE THIN-FILMS AS DIFFUSION-BARRIERS IN VERY LARGE-SCALE INTEGRATED-CIRCUITS [J].
KUMAR, N ;
MCGINN, JT ;
POURREZAEI, K ;
LEE, B ;
DOUGLAS, EC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (03) :1602-1608
[10]   FAILURE MECHANISMS OF TIN THIN-FILM DIFFUSION-BARRIERS [J].
KUMAR, N ;
POURREZAEI, K ;
LEE, B ;
DOUGLAS, EC .
THIN SOLID FILMS, 1988, 164 :417-428