ISOTHERMAL ANNEALING OF HILLOCKS IN AL-CU FILMS

被引：12

作者：

CHANG, CY ^{[1
]}

VOOK, RW ^{[1
]}

LEE, YC ^{[1
]}

HOSHI, I ^{[1
]}

机构：

[1] NIHON UNIV,COLL ENGN,DEPT PHYS,KORIYAMA,FUKUSHIMA 963,JAPAN

来源：

THIN SOLID FILMS | 1989年 / 181卷

关键词：

D O I：

10.1016/0040-6090(89)90472-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：57 / 63

页数：7

相关论文

共 10 条

[1] EFFECT OF MICROSTRUCTURE ON ELECTROMIGRATION LIFE OF THIN-FILM AL-CU CONDUCTORS
AGARWALA, BN
PATNAIK, B
SCHNITZE.R
[J]. JOURNAL OF APPLIED PHYSICS, 1972, 43 (04) : 1487 - &
[2] CHAKRAVE.BK, 1967, J PHYS CHEM SOLIDS, V28, P2401, DOI 10.1016/0022-3697(67)90026-1
[3] THERMALLY INDUCED HILLOCK FORMATION IN AL-CU FILMS
CHANG, CY
VOOK, RW
[J]. JOURNAL OF MATERIALS RESEARCH, 1989, 4 (05) : 1172 - 1181
[4] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS
CHAUDHARI, P
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) : 197 - +
[5] GHANDI SK, 1983, VLSI FABRICATION PRI, P387
[6] GLEITER H, 1983, PHYS MET METALLOGR, P684
[7] ACTIVATION-ENERGIES FOR THE DIFFERENT ELECTROMIGRATION MECHANISMS IN ALUMINUM
SCHREIBER, HU
[J]. SOLID-STATE ELECTRONICS, 1981, 24 (06) : 583 - &
[8] TOWNER JM, 1984, SOLID STATE TECH OCT, P197
[9] THERMALLY INDUCED STRAINS IN EVAPORATED FILMS
VOOK, RW
WITT, F
[J]. JOURNAL OF APPLIED PHYSICS, 1965, 36 (07) : 2169 - &
[10] THERMALLY INDUCED STRAINS IN CUBIC METAL FILMS
WITT, F
VOOK, RW
[J]. JOURNAL OF APPLIED PHYSICS, 1968, 39 (06) : 2773 - &