EFFECT OF OXYGEN ON FLUORINE-BASED REMOTE PLASMA-ETCHING OF SILICON AND SILICON DIOXIDE

被引:20
作者
LOEWENSTEIN, LM
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1988年 / 6卷 / 03期
关键词
D O I
10.1116/1.575221
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
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页码:1984 / 1988
页数:5
相关论文
共 23 条
[1]   DECOMPOSITION AND PRODUCT FORMATION IN CF4-O2 PLASMA-ETCHING SILICON IN THE AFTERGLOW [J].
BEENAKKER, CIM ;
VANDOMMELEN, JHJ ;
VANDEPOLL, RPJ .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (01) :480-485
[2]   MASS-SPECTROMETRIC TRANSIENT STUDY OF DC PLASMA-ETCHING OF SI IN CF4 AND CF4/O2 MIXTURES [J].
BRANDT, WW ;
HONDA, T .
JOURNAL OF APPLIED PHYSICS, 1985, 57 (01) :119-122
[3]   APPLICATION OF ELECTRON-PARAMAGNETIC-RES SPECTROSCOPY TO OXIDATIVE REMOVAL OF ORGANIC MATERIALS [J].
COOK, JM ;
BENSON, BW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (12) :2459-2464
[4]   SPECTROSCOPIC DIAGNOSTICS OF CF4-O2 PLASMAS DURING SI AND SIO2 ETCHING PROCESSES [J].
DAGOSTINO, R ;
CRAMAROSSA, F ;
DEBENEDICTIS, S ;
FERRARO, G .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (03) :1259-1265
[5]   REACTION OF ATOMIC AND MOLECULAR CHLORINE WITH ALUMINUM [J].
DANNER, DA ;
HESS, DW .
JOURNAL OF APPLIED PHYSICS, 1986, 59 (03) :940-947
[6]  
DEMORE WB, 1982, PUBLICATION JET PROP, V8257
[7]   STUDIES OF CHEMI-LUMINESCENCE ACCOMPANYING FLUORINE ATOM ETCHING OF SILICON [J].
DONNELLY, VM ;
FLAMM, DL .
JOURNAL OF APPLIED PHYSICS, 1980, 51 (10) :5273-5276
[8]   DECAPSULATION AND PHOTORESIST STRIPPING IN OXYGEN MICROWAVE PLASMAS [J].
DZIOBA, S ;
ESTE, G ;
NAGUIB, HM .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (11) :2537-2541
[9]  
Flamm D.L., 1981, PLASMA CHEM PLASMA P, V1, P317, DOI [10.1007/bf00565992, DOI 10.1007/BF00565992]
[10]   THE REACTION OF FLUORINE-ATOMS WITH SILICON [J].
FLAMM, DL ;
DONNELLY, VM ;
MUCHA, JA .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (05) :3633-3639