共 72 条
- [1] ARCOT B, 1991, MATER RES SOC SYMP P, V203, P27
- [2] AWAYA N, 1989, 1989 SYMPOSIUM ON VLSI TECHNOLOGY, P103
- [3] BERTI A, 1993, NY SCOE REV
- [4] BOJARCZUK NA, 1991, MATER RES SOC SYMP P, V203, P387
- [5] LOW RESISTIVITY BODY-CENTERED CUBIC TANTALUM THIN-FILMS AS DIFFUSION-BARRIERS BETWEEN COPPER AND SILICON [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1992, 10 (05): : 3318 - 3321
- [6] THERMAL-STABILITY OF THE CU/PD/SI METALLURGY [J]. APPLIED PHYSICS LETTERS, 1989, 55 (15) : 1543 - 1545
- [8] THERMAL-STABILITY OF THE CU/TA/PTSI STRUCTURES [J]. JOURNAL OF APPLIED PHYSICS, 1990, 67 (12) : 7348 - 7350
- [10] A COMPARISON BETWEEN ALUMINUM AND COPPER INTERACTIONS WITH HIGH-TEMPERATURE OXIDE AND NITRIDE DIFFUSION-BARRIERS [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1989, 7 (03): : 784 - 789