SUB-HALF-MICRON METAL-OXIDE-SEMICONDUCTOR DEVICE FABRICATION USING A COMPACT SYNCHROTRON-RADIATION LITHOGRAPHY SYSTEM

被引:10
作者
FUJII, K [1 ]
TSUBOI, S [1 ]
YOSHIHARA, T [1 ]
TANAKA, Y [1 ]
SUZUKI, K [1 ]
SETOGUCHI, S [1 ]
MIYATAKE, T [1 ]
机构
[1] SUMITOMO HEAVY IND LTD, QUANTUM EQUIPMENT TECHNOL LAB, TANASHI, TOKYO 188, JAPAN
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1993年 / 11卷 / 06期
关键词
D O I
10.1116/1.586557
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to evaluate the usefulness of the compact synchrotron radiation (SR) lithography system using a superconducting synchrotron light source ''AURORA,'' sub-half-micron metal-oxide-semiconductor devices were fabricated. This article describes the SR lithography system including x-ray masks, the device fabrication processes, and the characteristics of the resulting devices. Excellent overlay accuracy, better than 90 nm (3 sigma), was obtained using chromatic bifocus alignment optics in most levels. Though no radiation effect is observed in initial device characteristics, hot-electron-induced instability is observed in 2000 mJ/cm2-irradiated devices. If high-speed resists with 100-200 mJ/cm2 sensitivity were used, the instability would be reduced to a negligible level.
引用
收藏
页码:2897 / 2901
页数:5
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