ADHESION OF TITANIUM THIN-FILM TO OXIDE SUBSTRATES

被引:27
作者
KIM, YH
CHAUG, YS
CHOU, NJ
KIM, J
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 1987年 / 5卷 / 05期
关键词
D O I
10.1116/1.574259
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:2890 / 2893
页数:4
相关论文
共 21 条
[1]   ION-BEAM BONDING OF THIN-FILMS [J].
BAGLIN, JEE ;
CLARK, GJ .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1985, 7-8 (MAR) :881-885
[2]  
BAGLIN JEE, 1980, P THIN FILMS RELATIO, V47, P3
[3]   ADHESION OF EVAPORATED METAL FILMS ON GLASS [J].
BENJAMIN, P ;
WEAVER, C .
PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1961, 261 (1304) :516-+
[4]  
CAULTON M, 1979, RCA REV, V40, P115
[5]   THIN-FILM ADHESION [J].
CHAPMAN, BN .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (01) :106-113
[6]   INTERACTION OF TI WITH FUSED-SILICA AND SAPPHIRE DURING METALLIZATION [J].
CHAUG, YS ;
CHOU, NJ ;
KIM, YH .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (04) :1288-1291
[7]  
COOK CF, 1980, P THIN FILM INTERFAC, V80, P47
[8]   CALCULATIONS OF VANDERWAALS ADHESION [J].
HARRACH, HV .
THIN SOLID FILMS, 1974, 22 (03) :305-315
[9]   AN XPS STUDY OF THE INFLUENCE OF ION SPUTTERING ON BONDING IN THERMALLY GROWN SILICON DIOXIDE [J].
HOFMANN, S ;
THOMAS, JH .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (01) :43-47
[10]   SCRATCH TEST FOR MEASURING ADHERENCE OF THIN FILMS TO OXIDE SUBSTRATES [J].
KARNOWSKY, MM ;
ESTILL, WB .
REVIEW OF SCIENTIFIC INSTRUMENTS, 1964, 35 (10) :1324-&