TEMPERATURE DISTRIBUTION ON THIN-FILM METALLIZATIONS

被引：15

作者：

CHAUG, YS

HUANG, HL

机构：

[1] TATUNG INST TECHNOL,TAIPEI,TAIWAN

[2] NATL TAIWAN UNIV,DEPT PHYS,TAIPEI,TAIWAN

来源：

关键词：

D O I：

10.1063/1.322890

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1775 / 1779

页数：5

共 9 条

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BLECH, IA
ROSENBERG, R
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[2] TEMPERATURE DISTRIBUTION IN A CRACKED STRIPE
CHAUG, YS
HUANG, HL
[J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 1975, 14 (03) : 431 - 432
[3] CHHABRA D, 1967, TR22419 IBM REP
[4] CHUAG YS, 1975, JPN J APPL PHYS, V14, P267
[5] Huang H. L., 1973, Chinese Journal of Physics, V11, P18
[6] CONTROVERSY ABOUT DIRECTION OF ELECTROTRANSPORT IN THIN GOLD-FILMS
HUMMEL, RE
DEHOFF, RT
[J]. APPLIED PHYSICS LETTERS, 1975, 27 (02) : 64 - 66
[7] JEPSON DW, 1967, NC753 IBM REP
[8] ROBERTS TE, 1967, TABLE LAPLACE TRANSF, P281
[9] ELECTROMIGRATION AND METALIZATION LIFETIMES
SIGSBEE, RA
[J]. JOURNAL OF APPLIED PHYSICS, 1973, 44 (06) : 2533 - 2540