CONTROVERSY ABOUT DIRECTION OF ELECTROTRANSPORT IN THIN GOLD-FILMS

被引：5

作者：

HUMMEL, RE ^{[1
]}

DEHOFF, RT ^{[1
]}

机构：

[1] UNIV FLORIDA,DEPT MAT SCI & ENGN,GAINESVILLE,FL 32611

来源：

APPLIED PHYSICS LETTERS | 1975年 / 27卷 / 02期

关键词：

D O I：

10.1063/1.88367

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：64 / 66

页数：3

共 14 条

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ROSENBERG, R .

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[4]

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[5] ELECTROMIGRATION IN THIN SILVER, COPPER, GOLD, INDIUM, TIN, LEAD AND MAGNESIUM FILMS [J].

BREITLING, HM ;

HUMMEL, RE .

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1972, 33 (04) :845-+

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ENGLISH, AT ;

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JOURNAL OF APPLIED PHYSICS, 1974, 45 (09) :3757-3767

[7] ACTIVATION-ENERGY FOR ELECTROMIGRATION AND GRAIN-BOUNDARY SELF-DIFFUSION IN GOLD [J].

GANGULEE, A ;

DHEURLE, FM .

SCRIPTA METALLURGICA, 1973, 7 (10) :1027-1030

[8] ELECTROMIGRATION AND TRANSPORT REVERSAL IN COPPER-SILVER THIN-FILMS [J].

GANGULEE, A ;

DHEURLE, FM .

JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1974, 35 (03) :293-299

[9] ELECTROMIGRATION IN THIN GOLD FILMS [J].

HARTMAN, TE ;

BLAIR, JC .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1969, ED16 (04) :407-&

[10] DIRECTION OF ELECTROMIGRATION IN THIN SILVER, GOLD, AND COPPER FILMS [J].

HUMMEL, RE ;

BREITLING, RM .

APPLIED PHYSICS LETTERS, 1971, 18 (09) :373-+

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