RAPID THERMAL ANNEALING OF AL-SI CONTACTS

被引:14
作者
PAI, CS
CABREROS, E
LAU, SS
SEIDEL, TE
SUNI, I
机构
[1] AT&T BELL LABS,MURRAY HILL,NJ 07974
[2] TECH RES CTR FINLAND,SEMICOND LAB,ESPOO 15,FINLAND
关键词
D O I
10.1063/1.95517
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:652 / 654
页数:3
相关论文
共 10 条
  • [1] COHEN S, 1983, INTERFACES CONTACTS, P361
  • [2] ELIMINATION OF HILLOCKS ON AL-SI METALLIZATION BY FAST-HEAT-PULSE ALLOYING
    FAITH, TJ
    WU, CP
    [J]. APPLIED PHYSICS LETTERS, 1984, 45 (04) : 470 - 472
  • [3] CONTACT RESISTANCE OF AL/SI OHMIC ELECTRODES FORMED BY RAPID LAMP SINTERING
    HARA, T
    SUZUKI, H
    FURUKAWA, M
    AMEMIYA, K
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1983, 22 (06): : L340 - L342
  • [4] AL-SI CONTACTS FORMED BY ION IRRADIATION AND POST-ANNEALING
    HUNG, LS
    MAYER, JW
    ZHANG, M
    WOLF, ED
    [J]. APPLIED PHYSICS LETTERS, 1983, 43 (12) : 1123 - 1125
  • [5] HUNG LS, 1984, THIN FILMS INTERFACE, V2, P253
  • [6] PAI CS, 1984, UNPUB THIN SOLID FIL
  • [7] DIRECT MEASUREMENTS OF INTERFACIAL CONTACT RESISTANCE, END CONTACT RESISTANCE, AND INTERFACIAL CONTACT LAYER UNIFORMITY
    PROCTOR, SJ
    LINHOLM, LW
    MAZER, JA
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1983, 30 (11) : 1535 - 1542
  • [8] Rosenberg R., 1978, Thin films. Interdiffusion and reactions, P13
  • [9] SEIDEL TE, 1984, UNPUB NUCL INSTRUM B
  • [10] TATTA PA, 1969, IBM J RES REV, V13, P226