A STUDY OF TURN-OFF LIMITATIONS AND FAILURE MECHANISMS OF GTO THYRISTORS BY MEANS OF 2-D TIME-RESOLVED OPTICAL MEASUREMENTS

被引:15
作者
BLEICHNER, H
BAKOWSKI, M
ROSLING, M
NORDLANDER, E
VOBECKY, J
LUNDQVIST, M
BERG, S
机构
[1] Institute of Technology, Department of Electronics, Uppsala University, Uppsala
关键词
D O I
10.1016/0038-1101(92)90198-L
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The failure mechanisms of Gate-Turn-Off (GTO) thyristors are investigated. Measurements based on a time-resolved free-carrier absorption (FCA) technique are used to support the presented models. The measurements serve to map the local carrier densities two-dimensionally, at any time of the switching cycle. Inductively loaded GTOs under snubberless operation are studied close to the safe-operating area (SOA) limit. Several important features of the destructive process are established, First, the existence of a quasi space-charge region, QSC, in the n base and charge focusing at the anode side of the device is noticed during the fall-time period. Secondly, a piling up of holes in the p base is followed by current filamentation during the tail period. The sequential behaviour of different phenomena and their possible causal explanations are also established. The expansion of the QSC towards the anode emitter causes the enhancement and focusing of the charge distribution in the vicinity of this junction. Two possible failure mechanisms, viz. local dynamic punch-through in the n base and local dynamic avalanche injection in the blocking junction are discussed in the light of the experimental results. It is also suggested that both the above mentioned failure mechanisms can be part of the chain of events leading to device failure. Regardless of which mechanism dominates, a high peak of excess holes appears in the p base in the beginning of the tail period. This charge debiases the cathode junction locally, i.e. compensates the negative bias of the cathode junction, and current filaments connecting the cathode and anode sides of the device are formed. The excessive power dissipation in the dominant filament causes failure and permanent damage.
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页码:1683 / 1695
页数:13
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