MOSFET FABRICATION USING ION-BEAM NITRIDATION

被引:8
作者
TROXELL, JR
机构
[1] GM, Research Lab, Warren, MI, USA, GM, Research Lab, Warren, MI, USA
关键词
ION BEAM NITRIDATION - LOCAL OXIDATION - NITROGEN IMPLANTATION;
D O I
10.1007/BF02654307
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
(Edited Abstract)
引用
收藏
页码:707 / 728
页数:22
相关论文
共 20 条
[1]   IMPROVED HIGH-FREQUENCY MOS CAPACITANCE FORMULA [J].
BREWS, JR .
JOURNAL OF APPLIED PHYSICS, 1974, 45 (03) :1276-1279
[2]   A NEW METHOD TO DETERMINE MOSFET CHANNEL LENGTH [J].
CHERN, JGJ ;
CHANG, P ;
MOTTA, RF ;
GODINHO, N .
ELECTRON DEVICE LETTERS, 1980, 1 (09) :170-173
[3]  
CHIU KY, 1982, IEEE T ELECTRON DEV, V29, P536, DOI 10.1109/T-ED.1982.20739
[4]  
CHIU TY, 1984, J ELECTROCHEM SOC, V131, P2110, DOI 10.1149/1.2116029
[5]   IMPACT OF HIGH-TEMPERATURE PROCESSING ON BULK DEFECTS IN CZOCHRALSKI SILICON [J].
CLAEYS, C ;
BENDER, H ;
DECLERCK, G ;
VANLANDUYT, J ;
VANOVERSTRAETEN, R ;
AMELINCKX, S .
PHYSICA B & C, 1983, 116 (1-3) :148-161
[6]   EFFECT OF NEUTRAL ION-BEAM SPUTTERING AND ETCHING ON SILICON [J].
FONASH, SJ ;
ASHOK, S ;
SINGH, R .
THIN SOLID FILMS, 1982, 90 (03) :231-235
[7]   EFFECT OF ION-BEAM SPUTTER DAMAGE ON SCHOTTKY-BARRIER FORMATION IN SILICON [J].
FONASH, SJ ;
ASHOK, S ;
SINGH, R .
APPLIED PHYSICS LETTERS, 1981, 39 (05) :423-425
[8]  
GLASER AB, 1977, INTEGRATED CIRCUIT E, P301
[9]   SELECTIVE OXIDATION TECHNOLOGIES FOR HIGH-DENSITY MOS [J].
HUI, J ;
CHIU, TY ;
WONG, S ;
OLDHAM, WG .
ELECTRON DEVICE LETTERS, 1981, 2 (10) :244-247
[10]  
Hui J., 1982, International Electron Devices Meeting. Technical Digest, P220