SELECTIVE AND ANISOTROPIC REACTIVE ION ETCH OF LPCVD SILICON-NITRIDE WITH CHF3 BASED GASES

被引:29
作者
MELE, TC [1 ]
NULMAN, J [1 ]
KRUSIUS, JP [1 ]
机构
[1] CORNELL UNIV,SCH APPL & ENGN PHYS,ITHACA,NY 14853
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1984年 / 2卷 / 04期
关键词
D O I
10.1116/1.582863
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
14
引用
收藏
页码:684 / 687
页数:4
相关论文
共 14 条
[1]  
APPELS JA, 1970, PHILIPS RES REP, V25, P118
[2]  
CHANG JS, 1984, SOLID STATE TECHNOL, V27, P214
[3]   REACTIVE ION ETCHING FOR SUB-MICRON STRUCTURES [J].
CHINN, JD ;
ADESIDA, I ;
WOLF, ED ;
TIBERIO, RC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (04) :1418-1422
[4]  
CHIU KY, 1982, IEEE T ELECTRON DEV, V29, P536, DOI 10.1109/T-ED.1982.20739
[5]   THE REACTION OF FLUORINE-ATOMS WITH SILICON [J].
FLAMM, DL ;
DONNELLY, VM ;
MUCHA, JA .
JOURNAL OF APPLIED PHYSICS, 1981, 52 (05) :3633-3639
[6]   BASIC CHEMISTRY AND MECHANISMS OF PLASMA-ETCHING [J].
FLAMM, DL ;
DONNELLY, VM ;
IBBOTSON, DE .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (01) :23-30
[7]  
GHANDI SK, 1983, VLSI FABRICATION PRI, P506
[8]  
KURE T, 1983, 1983 P INT EL DEV M, P757
[9]   PROFILE CONTROL BY REACTIVE SPUTTER ETCHING [J].
LEHMANN, HW ;
WIDMER, R .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :319-326
[10]   HIGH-RESOLUTION ION-BEAM LITHOGRAPHY AT LARGE GAPS USING STENCIL MASKS [J].
RANDALL, JN ;
FLANDERS, DC ;
ECONOMOU, NP ;
DONNELLY, JP ;
BROMLEY, EI .
APPLIED PHYSICS LETTERS, 1983, 42 (05) :457-459