STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES

被引：408

作者：

HOFFMAN, RW ^{[1
]}

机构：

[1] CASE WESTERN RESERVE UNIV,DEPT PHYS,CLEVELAND,OH 44106

来源：

THIN SOLID FILMS | 1976年 / 34卷 / 02期

关键词：

D O I：

10.1016/0040-6090(76)90453-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：185 / 190

页数：6

共 15 条

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HOFFMAN, RW .

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[2] INTERNAL STRESSES [J].

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JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04) :606-+

[3]

Campbell DavidS., 1970, HDB THIN FILM TECHNO, P12

[4] GRAIN-GROWTH AND STRESS RELIEF IN THIN-FILMS [J].

CHAUDHAR.P .

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[5] MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].

CHAUDHARI, P .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) :197-+

[6] ORIGINS OF STRESS IN THIN NICKEL FILMS [J].

DOLJACK, FA ;

HOFFMAN, RW .

THIN SOLID FILMS, 1972, 12 (01) :71-&

[7] STRESS IN FILMS OF SILICON MONOXIDE [J].

HILL, AE ;

HOFFMAN, GR .

BRITISH JOURNAL OF APPLIED PHYSICS, 1967, 18 (01) :13-&

[8]

HOFFMAN RW, 1976, NATO ADV STUDY I SER, V14

[9] RECENT DEVELOPMENTS IN STUDY OF MECHANICAL PROPERTIES OF THIN-FILMS [J].

KINOSITA, K .

THIN SOLID FILMS, 1972, 12 (01) :17-&

[10]

Klockholm E., 1969, REV SCI INSTRUM, V40, P1054

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