DEPOSITION OF TANTALUM TANTALUM OXIDE AND TANTALUM NITRIDE WITH CONTROLLED ELECTRICAL CHARACTERISTICS

被引:55
作者
KRIKORIAN, E
SNEED, RJ
机构
关键词
D O I
10.1063/1.1707903
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:3674 / +
页数:1
相关论文
共 15 条
[1]  
ALTMAN C, PRIVATE COMMUNICATIO
[2]  
ALTMAN C, 1962, 9 T NAT VAC S, P174
[3]   EFFECTS OF NITROGEN METHANE + OXYGEN ON STRUCTURE + ELECTRICAL PROPERTIES OF THIN TANTALUM FILMS [J].
GERSTENBERG, D ;
CALBICK, CJ .
JOURNAL OF APPLIED PHYSICS, 1964, 35 (02) :402-&
[4]   HIGH RESISTIVITY SPUTTERED TANTALUM FILMS FOR MICROELECTRONIC APPLICATIONS [J].
KRIKORIA.E ;
BERSON, BE .
PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1965, 53 (12) :2164-&
[5]   EPITAXIAL DEPOSITION OF GERMANIUM BY BOTH SPUTTERING AND EVAPORATION [J].
KRIKORIAN, E ;
SNEED, RJ .
JOURNAL OF APPLIED PHYSICS, 1966, 37 (10) :3665-+
[6]  
KRIKORIAN E, AFALTR6589 FIN TECHN
[7]   THIN FILMS DEPOSITED BY BIAS SPUTTERING [J].
MAISSEL, LI ;
SCHAIBLE, PM .
JOURNAL OF APPLIED PHYSICS, 1965, 36 (01) :237-&
[8]  
MAISSEL LI, 1962, 9 T VAC S AM VAC SOC, P169
[9]   TANTALUM-FILM TECHNOLOGY [J].
MCLEAN, DA ;
SCHWARTZ, N ;
TIDD, ED .
PROCEEDINGS OF THE IEEE, 1964, 52 (12) :1450-&
[10]   A NEW STRUCTURE IN TANTALUM THIN FILMS (VAPOR DEPOSITION SUPERCONDUCTIVITY SPUTTERING X-RAY DIFFRACTION E) [J].
READ, MH ;
ALTMAN, C .
APPLIED PHYSICS LETTERS, 1965, 7 (03) :51-&