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PLASMA PROCESSING IN MICROELECTRONICS MANUFACTURING

被引：48
作者：
GRAVES, DB
机构：
[1] Univ of California, United States
来源：
AICHE JOURNAL | 1989年 / 35卷 / 01期
关键词：
Chemical Equipment--Reactors - Etching - Integrated Circuits; VLSI--Manufacture; -; Plasmas; Spectroscopy;
D O I：
10.1002/aic.690350102
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
The purposes of this review are to introduce chemical engineers to plasma processing practice and phenomenology; to outline the progress made to date in fundamental studies of discharge physics and chemistry; to indicate areas in which chemical engineers must expand their traditional training to participate in plasma processing research; and finally to suggest how established chemical engineering methodology can be applied to plasma chemical reactors.
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页码：1 / 29
页数：29
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