REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .2. LONG-TERM RELIABILITY

被引：5

作者：

PANOUSIS, NT ^{[1
]}

HALL, PM ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1977年 / 13卷 / 03期

关键词：

D O I：

10.1109/TPHP.1977.1135202

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：309 / 313

页数：5

共 8 条

[1] FORMALISM FOR DETERMINING GRAIN-BOUNDARY DIFFUSION-COEFFICIENTS USING SURFACE ANALYSIS [J].

HALL, PM ;

MORABITO, JM .

SURFACE SCIENCE, 1976, 59 (02) :624-630

[2] STRENGTH OF GOLD-PLATED COPPER LEADS ON THIN-FILM CIRCUITS UNDER ACCELERATED AGING [J].

HALL, PM ;

PANOUSIS, NT ;

MENZEL, PR .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :202-205

[3] INTERDIFFUSION IN CU-AU THIN-FILM SYSTEM AT 25DEGREESC TO 250DEGREESC [J].

HALL, PM ;

MORABITO, JM ;

PANOUSIS, NT .

THIN SOLID FILMS, 1977, 41 (03) :341-361

[4] OXYGEN EMBRITTLEMENT OF COPPER LEADS [J].

PANOUSIS, NT ;

WONSIEWICZ, BC ;

CONDRA, LW .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (02) :127-132

[5] EFFECTS OF GOLD AND NICKEL PLATING THICKNESSES ON STRENGTH AND RELIABILITY OF THERMOCOMPRESSION-BONDED EXTERNAL LEADS [J].

PANOUSIS, NT ;

HALL, PM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1976, 12 (04) :282-288

[6] REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .1. INITIAL CHARACTERIZATION [J].

PANOUSIS, NT ;

HALL, PM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03) :305-309

[7]

PANOUSIS NT, TO BE PUBLISHED

[8]

PINNEL MR, 1972, METALL TRANS, V3, P1989, DOI 10.1007/BF02642589

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