MODEL OF SILICON EPITAXIAL-GROWTH IN SICL4-HC1-H2 SYSTEM BASED ON FLOW GRAPH

被引:10
作者
KOREC, J
机构
[1] Scientific-Research Centre of Semiconductors, 02-673 Warszawa
关键词
D O I
10.1016/0022-0248(79)90084-8
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
A flow graph method of CVD process modelling and its application to silicon epitaxial growth in the SiCl4-HCl-H2 system is presented. A theoretical formula is developed giving the dependence of gas phase etching and growth rate of silicon on process technological parameters. Experimental verification of the model is presented. © 1979.
引用
收藏
页码:362 / 370
页数:9
相关论文
共 22 条
[1]  
ALEXANDER EG, 1967, J ELECTROCHEM SOC, V114, pC65
[2]   CHEMISTRY AND TRANSPORT PHENOMENA OF CHEMICAL VAPOR-DEPOSITION OF SILICON FROM SICL4 [J].
BAN, VS ;
GILBERT, SL .
JOURNAL OF CRYSTAL GROWTH, 1975, 31 (DEC) :284-289
[3]   CHEMICAL PROCESSES IN VAPOR-DEPOSITION OF SILICON .1. DEPOSITION FROM SICL2H2 AND ETCHING BY HCL [J].
BAN, VS ;
GILBERT, SL .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1975, 122 (10) :1382-1388
[4]   SILICON EPITAXY FROM MIXTURES OF SIH4 AND HC1 [J].
BLOEM, J .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1970, 117 (11) :1397-&
[5]   HIGH CHEMICAL VAPOR-DEPOSITION RATES OF EPITAXIAL SILICON LAYERS [J].
BLOEM, J .
JOURNAL OF CRYSTAL GROWTH, 1973, 18 (01) :70-76
[7]  
BRANDT S, 1970, STATISTICAL COMPUTAT, P163
[8]  
CHOW Y, 1965, THEORIE APPLICATIONS
[9]  
Douglas JM., 1972, PROCESS DYNAMICS CON
[10]   A STAGNANT LAYER MODEL FOR EPITAXIAL GROWTH OF SILICON FROM SILANE IN A HORIZONTAL REACTOR [J].
EVERSTEYN, FC ;
SEVERIN, PJW ;
BREKEL, CHJV ;
PEEK, HL .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1970, 117 (07) :925-+