PROPERTIES OF DC MAGNETRON REACTIVELY SPUTTERED TIN

被引：18

作者：

STIMMELL, J

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1986年 / 4卷 / 06期

关键词：

D O I：

10.1116/1.583461

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：1377 / 1382

页数：6

共 13 条

[1]

ABOELFOTOH MO, 1986, UNPUB APR P SPRING M

[2]

DEBLASI JM, UNPUB 1986 P MAT RES

[3] MOLYBDENUM NITRIDE FILM FORMATION [J].

KIM, MJ ;

BROWN, DM ;

KATZ, W .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (05) :1196-1200

[4]

MATTAUSCH HJ, 1983, J VAC SCI TECHNOL B, V1, P23

[5] COLOR OF TITANIUM NITRIDE PREPARED BY REACTIVE DC MAGNETRON SPUTTERING [J].

MUMTAZ, A ;

CLASS, WH .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 20 (03) :345-348

[6] DIFFUSION-BARRIERS IN LAYERED CONTACT STRUCTURES [J].

NICOLET, MA ;

BARTUR, M .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (03) :786-793

[7] REACTIVELY SPUTTERED TIN, ZRN, AND HFN [J].

SPROUL, WD .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (03) :580-581

[8] MECHANISMS OF REACTIVE SPUTTERING OF TITANIUM NITRIDE AND TITANIUM CARBIDE .2. MORPHOLOGY AND STRUCTURE [J].

SUNDGREN, JE ;

JOHANSSON, BO ;

KARLSSON, SE ;

HENTZELL, HTG .

THIN SOLID FILMS, 1983, 105 (04) :367-384

[9]

SUNDGREN JE, 1985, THIN SOLID FILMS, V40, P6090

[10] THE USE OF TITANIUM-BASED CONTACT BARRIER LAYERS IN SILICON TECHNOLOGY [J].

TING, CY ;

WITTMER, M .

THIN SOLID FILMS, 1982, 96 (04) :327-345

← 1 2 →