DAILY 2X10(12) MONITORING OF AN ION IMPLANTER

被引:2
作者
CHEREKDJIAN, S
WEISENBERGER, W
机构
[1] Ion Implant Services, Sunnyvale, CA
关键词
D O I
10.1016/0168-583X(91)96157-G
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Low-dose monitoring has always been a problem. The monitors drift with time either within minutes of an implant or within days or months. Resistivity excursions in excess of 50% are not uncommon. This paper presents data to understand some of the factors affecting the reliability and repeatability of low-dose, 2 x 10(12) ions cm-2, sheet resistivity measurements. Four-point probe electronic drift, the optimum probe tip size and finish, background silicon substrate doping, surface oxide growth, and silicon surface chemistry are investigated. The correct specifications of the wafers, wafer processing and the four-point probe tips enable reproducible measurement of low-dose boron implants.
引用
收藏
页码:178 / 182
页数:5
相关论文
共 14 条
[1]  
CHANTRE D, 1988, J ELECTROCHEM SOC, V135, P2867
[2]   PLANAR CHANNELING EFFECTS IN SI(100) [J].
CURRENT, MI ;
TURNER, NL ;
SMITH, TC ;
CRANE, D .
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 1985, 6 (1-2) :336-348
[3]   INVESTIGATIONS ON HYDROPHILIC AND HYDROPHOBIC SILICON (100) WAFER SURFACES BY X-RAY PHOTOELECTRON AND HIGH-RESOLUTION ELECTRON-ENERGY LOSS-SPECTROSCOPY [J].
GRUNDNER, M ;
JACOB, H .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1986, 39 (02) :73-82
[4]  
HEMMENT PLF, 1984, ION IMP SCI TECH, P211
[6]  
JULEFF EM, 1982, SOLID STATE TECH SEP, P82
[7]  
KRAMER S, 1977, SOLID STATE ELECTRON, V20, P1011
[8]  
Nadeau N., 1989, Microelectronic Manufacturing and Testing, V12, P35
[9]   NEUTRALIZATION OF SHALLOW ACCEPTOR LEVELS IN SILICON BY ATOMIC-HYDROGEN [J].
PANKOVE, JI ;
CARLSON, DE ;
BERKEYHEISER, JE ;
WANCE, RO .
PHYSICAL REVIEW LETTERS, 1983, 51 (24) :2224-2225
[10]  
PEARTON SJ, 1989, SOLID STATE INTEGRAT, P56