共 20 条
[11]
MECHANICAL-BEHAVIOR OF MICROSTRIP STRUCTURES MADE FROM YBA2CU3O7-X SUPERCONDUCTING CERAMICS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1988, 11 (04)
:419-426
[12]
THERMAL-STRESS ANALYSIS OF SOIC PACKAGES AND INTERCONNECTIONS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1988, 11 (04)
:380-389
[13]
ELASTOPLASTIC ANALYSIS OF SURFACE-MOUNT SOLDER JOINTS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1987, 10 (03)
:346-357
[14]
THE EFFECT OF JOINT DESIGN ON THE THERMAL FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1985, 8 (04)
:417-426
[15]
Silvester P. P, 1983, FINITE ELEMENTS ELEC
[16]
Stevens K. K., 1990, Transactions of the ASME. Journal of Electronic Packaging, V112, P162, DOI 10.1115/1.2904357
[17]
Zienkiewicz O. C., 1977, FINITE ELEMENT METHO
[18]
1989, MSC NASTRAN USERS GU, V1
[19]
1989, MSC NASTRAN USERS GU, V2
[20]
1989, ABAQUS USERS GUIDE