MODELING OF MULTILEVEL STRUCTURES - A GENERAL-METHOD FOR ANALYZING STRESS EVOLUTION DURING PROCESSING

被引:15
作者
CIFUENTES, AO
SHAREEF, IA
机构
[1] IBM Corporation, York-, town Heights, NY, 10598, MS 2-126
关键词
D O I
10.1109/66.136274
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents a general modeling technique for following the evolution of the stress field during the manufacturing of multilevel structures. This technique combines the finite element method with a modeling strategy that uses artificial nodes to simulate material interfaces. It can be applied to both linear and nonlinear structures. The main advantage of this approach is that it allows one to account for all topological and geometric changes during the manufacturing process, as well as the residual stresses introduced at each stage. Its implementation is very straightforward since it is compatible with current finite element technology and most commercial codes. The usefulness of this technique is illustrated with an example concerning an encapsulated copper line.
引用
收藏
页码:128 / 137
页数:10
相关论文
共 20 条
[11]   MECHANICAL-BEHAVIOR OF MICROSTRIP STRUCTURES MADE FROM YBA2CU3O7-X SUPERCONDUCTING CERAMICS [J].
LAU, JH ;
MORESCO, LL .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1988, 11 (04) :419-426
[12]   THERMAL-STRESS ANALYSIS OF SOIC PACKAGES AND INTERCONNECTIONS [J].
LAU, JH ;
HARKINS, CG .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1988, 11 (04) :380-389
[13]   ELASTOPLASTIC ANALYSIS OF SURFACE-MOUNT SOLDER JOINTS [J].
LAU, JH ;
RICE, DW ;
AVERY, PA .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (03) :346-357
[14]   THE EFFECT OF JOINT DESIGN ON THE THERMAL FATIGUE LIFE OF LEADLESS CHIP CARRIER SOLDER JOINTS [J].
SHERRY, WM ;
ERICH, JS ;
BARTSCHAT, MK ;
PRINZ, FB .
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (04) :417-426
[15]  
Silvester P. P, 1983, FINITE ELEMENTS ELEC
[16]  
Stevens K. K., 1990, Transactions of the ASME. Journal of Electronic Packaging, V112, P162, DOI 10.1115/1.2904357
[17]  
Zienkiewicz O. C., 1977, FINITE ELEMENT METHO
[18]  
1989, MSC NASTRAN USERS GU, V1
[19]  
1989, MSC NASTRAN USERS GU, V2
[20]  
1989, ABAQUS USERS GUIDE