ACCELERATION OF PLASMA ETCH RATE CAUSED BY ALKALINE RESIDUES

被引:18
作者
MAKINO, T
NAKAMURA, H
ASANO, M
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D O I
10.1149/1.2127347
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
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页码:103 / 106
页数:4
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共 15 条
[1]   ETCHING CHARACTERISTICS OF SILICON AND ITS COMPOUNDS BY GAS PLASMA [J].
ABE, H ;
SONOBE, Y ;
ENOMOTO, T .
JAPANESE JOURNAL OF APPLIED PHYSICS, 1973, 12 (01) :154-155
[2]   WORK FUNCTION, PHOTOELECTRIC THRESHOLD, AND SURFACE STATES OF ATOMICALLY CLEAN SILICON [J].
ALLEN, FG ;
GOBELI, GW .
PHYSICAL REVIEW, 1962, 127 (01) :150-&
[4]  
BERSIN RL, 1976, SOLID STATE TEC 0531
[5]   ENHANCEMENT OF SILICON CHEMICAL VAPOR-DEPOSITION RATES AT LOW-TEMPERATURES [J].
CHANG, CA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1976, 123 (08) :1245-1247
[6]  
COTTON FA, 1966, ADV INORGANIC CHEM, P446
[8]  
EVERSTEYN FC, 1973, J ELCHEM SO, V121, P106
[9]   ETCHING CHARACTERISTICS OF PHOSPHORUS CONTAINING POLYCRYSTALLINE SILICON IN A CF4 PLASMA [J].
JINNO, K ;
KINOSHITA, H ;
MATSUMOTO, Y .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (05) :827-828
[10]  
JINNO K, 1976, DENKI KAGAKU, V44, P205