THE DEPOSITION AND FILM PROPERTIES OF REACTIVELY SPUTTERED TITANIUM NITRIDE

[1] ROLE OF METAL-SEMICONDUCTOR INTERFACE IN SILICON INTEGRATED-CIRCUIT TECHNOLOGY [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (06): : 972 - 984

[2] TIN COATINGS ON STEEL [J]. THIN SOLID FILMS, 1981, 80 (1-3) : 265 - 270

[3] FORMATION OF TIN/TISI2/P+-SI/N-SI BY RAPID THERMAL ANNEALING (RTA) SILICON IMPLANTED WITH BORON THROUGH TITANIUM [J]. IEEE ELECTRON DEVICE LETTERS, 1985, 6 (11) : 591 - 593

[4] LIFETIME AND DRIFT VELOCITY ANALYSIS FOR ELECTROMIGRATION IN SPUTTERED AL FILMS, MULTILAYERS, AND ALLOYS [J]. SOLID-STATE ELECTRONICS, 1983, 26 (10) : 1023 - &

[5] HOSACK HH, 1973, J APPL PHYS, V44, P8

[6] Iyer S. S., 1984, 22nd Annual Proceedings on Reliability Physics 1984 (Catalog No. 84CH1990-1), P273, DOI 10.1109/IRPS.1984.362058

[7] JONES RE, 1985, 2ND P INT IEEE VLSI, P194

[8] KANEKO H, 1985, 1985 IEEE INT EL DEV, P208

[9] INFLUENCE OF THE NITROGEN PARTIAL-PRESSURE ON THE PROPERTIES OF DC-SPUTTERED TITANIUM AND TITANIUM NITRIDE FILMS [J]. THIN SOLID FILMS, 1984, 111 (04) : 339 - 349

[10] APPLICATIONS OF WEAR-RESISTANT THICK-FILMS FORMED BY PHYSICAL VAPOR-DEPOSITION PROCESSES [J]. THIN SOLID FILMS, 1977, 40 (JAN) : 155 - 167

[1] ROLE OF METAL-SEMICONDUCTOR INTERFACE IN SILICON INTEGRATED-CIRCUIT TECHNOLOGY [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1974, 11 (06): : 972 - 984

[2] TIN COATINGS ON STEEL [J]. THIN SOLID FILMS, 1981, 80 (1-3) : 265 - 270

[3] FORMATION OF TIN/TISI2/P+-SI/N-SI BY RAPID THERMAL ANNEALING (RTA) SILICON IMPLANTED WITH BORON THROUGH TITANIUM [J]. IEEE ELECTRON DEVICE LETTERS, 1985, 6 (11) : 591 - 593

[4] LIFETIME AND DRIFT VELOCITY ANALYSIS FOR ELECTROMIGRATION IN SPUTTERED AL FILMS, MULTILAYERS, AND ALLOYS [J]. SOLID-STATE ELECTRONICS, 1983, 26 (10) : 1023 - &

[5] HOSACK HH, 1973, J APPL PHYS, V44, P8

[6] Iyer S. S., 1984, 22nd Annual Proceedings on Reliability Physics 1984 (Catalog No. 84CH1990-1), P273, DOI 10.1109/IRPS.1984.362058

[7] JONES RE, 1985, 2ND P INT IEEE VLSI, P194

[8] KANEKO H, 1985, 1985 IEEE INT EL DEV, P208

[9] INFLUENCE OF THE NITROGEN PARTIAL-PRESSURE ON THE PROPERTIES OF DC-SPUTTERED TITANIUM AND TITANIUM NITRIDE FILMS [J]. THIN SOLID FILMS, 1984, 111 (04) : 339 - 349

[10] APPLICATIONS OF WEAR-RESISTANT THICK-FILMS FORMED BY PHYSICAL VAPOR-DEPOSITION PROCESSES [J]. THIN SOLID FILMS, 1977, 40 (JAN) : 155 - 167