THERMOCOMPRESSION BONDABILITY OF BARE COPPER LEADS

被引：7

作者：

PANOUSIS, NT

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1978年 / 1卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1978.1135302

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：372 / 377

页数：6

共 9 条

[1]

AHMED N, 1975, SOLID STATE TECHNOL, P25

[2]

FEINSTEIN LG, COMMUNICATION

[3]

Hall Peter, COMMUNICATION

[4] STRENGTH OF GOLD-PLATED COPPER LEADS ON THIN-FILM CIRCUITS UNDER ACCELERATED AGING [J].

HALL, PM ;

PANOUSIS, NT ;

MENZEL, PR .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (03) :202-205

[5] INTERDIFFUSION IN CU-AU THIN-FILM SYSTEM AT 25DEGREESC TO 250DEGREESC [J].

HALL, PM ;

MORABITO, JM ;

PANOUSIS, NT .

THIN SOLID FILMS, 1977, 41 (03) :341-361

[6] NONPARAMETRIC-ESTIMATION FROM INCOMPLETE OBSERVATIONS [J].

KAPLAN, EL ;

MEIER, P .

JOURNAL OF THE AMERICAN STATISTICAL ASSOCIATION, 1958, 53 (282) :457-481

[7] OXYGEN EMBRITTLEMENT OF COPPER LEADS [J].

PANOUSIS, NT ;

WONSIEWICZ, BC ;

CONDRA, LW .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (02) :127-132

[8] REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .2. LONG-TERM RELIABILITY [J].

PANOUSIS, NT ;

HALL, PM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03) :309-313

[9] REDUCED GOLD-PLATING ON COPPER LEADS FOR THERMOCOMPRESSION BONDING .1. INITIAL CHARACTERIZATION [J].

PANOUSIS, NT ;

HALL, PM .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1977, 13 (03) :305-309

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