ANGULAR-DISTRIBUTION OF PARTICLES SPUTTERED FROM METALS AND ALLOYS

被引：39

作者：

WUCHER, A ^{[1
]}

REUTER, W ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1988年 / 6卷 / 04期

关键词：

D O I：

10.1116/1.575582

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：2316 / 2318

页数：3

共 13 条

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