SHORT-CHANNEL MOSFETS IN THE PUNCHTHROUGH CURRENT MODE

Results of two-dimensional device analysis are compfired with experiment for 0.8-μm Si-gate ion-implanted MOS devices operated under conditions of punchthrough transport. Characterization of the punchthrough mode of device operation (a critical factor which limits the maximum drain voltage of submicron MOS VLSI devices) with experiment and simulation has shown that the observed power- dependence of/Ds versus VDs (VGS= VSB ™ 0) is related to the drain-induced barrier-height lowering. Results of the simulation slow the dependence of the punchthrough current upon the range lnd maximum doping level of the channel implantation. Increasing the substrate-bias or applying a negative-gate voltage is shown to incirt ase the punchthrough voltage. This simulation, which combines result; i of the process-simulation program (SUPREM) and device-simulation progam (CADDET) is shown to predict the behavior of this mode of operaiion where previous one-dimensional theory has failed. Copyright © 1979 by The Institute of Electrical and Electronics Engineers, Inc.