THE INTERDEPENDENCE OF GEOMETRICAL, THERMAL, AND ELECTRICAL LIMITATIONS FOR VLSI LOGIC

被引：9

作者：

FOLBERTH, OG

机构：

来源：

关键词：

D O I：

10.1109/JSSC.1981.1051536

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：51 / 53

页数：3

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