REACTIVE SPUTTER ETCHING OF THIN-FILMS FOR PATTERN DELINEATION

[1] DEPOSITION RATE OF METALLIC THIN-FILMS IN REACTIVE SPUTTERING PROCESS [J]. THIN SOLID FILMS, 1975, 30 (01) : 19 - 27

[2] CANTAGREL M, 1973, J MATER SCI, V8, P1711, DOI 10.1007/BF02403521

[3] REACTIVE ION-BEAM SPUTTERING OF THIN-FILMS OF LEAD, ZIRCONIUM AND TITANIUM [J]. THIN SOLID FILMS, 1977, 46 (02) : 213 - 221

[4] VACUUM TECHNOLOGIES APPLIED TO ELECTRONIC-COMPONENT FABRICATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01): : 108 - 113

[5] REACTIVE SPUTTERING OF METALS IN OXIDIZING ATMOSPHERES [J]. THIN SOLID FILMS, 1973, 7 (02) : 163 - 176

[6] LABUDA EF, 1974, ELECTROCHEM SOC EXTE, V74, P195

[7] ION ETCHING FOR PATTERN DELINEATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (05): : 1008 - 1022

[1] DEPOSITION RATE OF METALLIC THIN-FILMS IN REACTIVE SPUTTERING PROCESS [J]. THIN SOLID FILMS, 1975, 30 (01) : 19 - 27

[2] CANTAGREL M, 1973, J MATER SCI, V8, P1711, DOI 10.1007/BF02403521

[3] REACTIVE ION-BEAM SPUTTERING OF THIN-FILMS OF LEAD, ZIRCONIUM AND TITANIUM [J]. THIN SOLID FILMS, 1977, 46 (02) : 213 - 221

[4] VACUUM TECHNOLOGIES APPLIED TO ELECTRONIC-COMPONENT FABRICATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (01): : 108 - 113

[5] REACTIVE SPUTTERING OF METALS IN OXIDIZING ATMOSPHERES [J]. THIN SOLID FILMS, 1973, 7 (02) : 163 - 176

[6] LABUDA EF, 1974, ELECTROCHEM SOC EXTE, V74, P195

[7] ION ETCHING FOR PATTERN DELINEATION [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1976, 13 (05): : 1008 - 1022