EFFECTS OF AR+ ANGLE OF INCIDENCE ON THE ETCHING OF SI WITH CL2 AND LOW-ENERGY AR+ IONS

被引:15
作者
VANZWOL, J
VANLAAR, J
KOLFSCHOTEN, AW
DIELEMAN, J
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1987年 / 5卷 / 05期
关键词
D O I
10.1116/1.583626
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
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页码:1410 / 1414
页数:5
相关论文
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