STRESS AND MICROSTRUCTURE IN TUNGSTEN SPUTTERED THIN-FILMS

被引：88

作者：

HAGHIRIGOSNET, AM ^{[1
]}

LADAN, FR ^{[1
]}

MAYEUX, C ^{[1
]}

LAUNOIS, H ^{[1
]}

JONCOUR, MC ^{[1
]}

机构：

[1] CTR NATL ETUD TELECOMMUN,F-92220 BAGNEUX,FRANCE

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1989年 / 7卷 / 04期

关键词：

D O I：

10.1116/1.575770

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：2663 / 2669

页数：7

共 34 条

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[6] THE DEVELOPMENT OF GRAIN-STRUCTURE DURING GROWTH OF METALLIC-FILMS
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[7] GRAIN-STRUCTURE VARIATION WITH TEMPERATURE FOR EVAPORATED METAL-FILMS
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[8] HEURLE FMD, 1970, METALL T, V1, P725
[9] COMPRESSIVE STRESS AND INERT-GAS IN MO FILMS SPUTTERED FROM A CYLINDRICAL POST MAGNETRON WITH NE, AR, KR, AND XE
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[10] INTERNAL-STRESSES IN SPUTTERED CHROMIUM
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