ALUMINUM NITRIDE FILMS BY RF REACTIVE ION-PLATING

Aluminum nitride films were synthesized successfully on silicon (111) and spinel (111) single crystal surfaces by rf reactive ion-plating. Aluminum was evaporated from an evaporator in the rf discharge phase of either nitrogen gas or ammonia gas. Film structures were evaluated using reflection high energy electron diffraction (RHEED) and scanning electron microscopy (SEM). The aluminum nitride films synthesized on the spinel (111) surfaces at the substrate temperature of 1000 degree C, in the rf discharge phase of both nitrogen gas and ammonia gas, are shown to be of single crystal form, having parallel orientation to the substrate surfaces. Aluminum nitride single crystals forming hexagonal pyramids were observed to grow in the perpendicular direction to the substrate surfaces during the investigation.