OXYGEN INCORPORATION IN AL THIN-FILMS DURING DEPOSITION BY DC MAGNETRON SPUTTERING

被引：8

作者：

POPOV, DN ^{[1
]}

KOTLAROVA, TK ^{[1
]}

UZUNOV, TD ^{[1
]}

GAYDAROVA, VN ^{[1
]}

机构：

[1] BULGARIAN ACAD SCI,INST MET TECHNOL & MET,BU-1574 SOFIA,BULGARIA

来源：

VACUUM | 1988年 / 38卷 / 11期

关键词：

D O I：

10.1016/0042-207X(88)90566-0

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1015 / 1017

页数：3

共 13 条

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[9] THE EFFECTS OF GAS-COMPOSITION ON DISCHARGE AND DEPOSITION CHARACTERISTICS WHEN MAGNETRON SPUTTERING ALUMINUM [J].

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[10] THE DEPENDENCE OF DEPOSITION RATE ON POWER INPUT FOR DC AND RF MAGNETRON SPUTTERING [J].

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