EFFECTS OF OXYGEN ION-IMPLANTATION ON THE STRUCTURE AND PROPERTIES OF ALUMINUM THIN-FILMS

被引:4
作者
GANGULEE, A
DHEURLE, FM
RANIERI, VA
FIORIO, RA
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1979年 / 16卷 / 02期
关键词
D O I
10.1116/1.569893
中图分类号
O59 [应用物理学];
学科分类号
摘要
Aluminum thin films having a nominal thickness of 350 nm were implanted with oxygen ions to integrated dosage of 10**1**7-10**1**8 atom/cm**2. Structural investigations by x-ray diffraction techniques indicated that ion implanation substantially decreased the particle size, increased the magnitude of microstrains and introduced significant amount of stacking faults. Implantation also tended to introduce macroscopic compressive stresses. Both structural and electrical resistivity measurements showed that the ion implanted structure has exceptional thermal stability. Cross-stripe experiments gave direct evidence that oxygen ion implantation decreases the grain boundary diffusivity in aluminum.
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页码:156 / 159
页数:4
相关论文
共 21 条
[1]   ISOLATING SURFACE LAYERS ON METALLIC CONDUCTORS PRODUCED BY ION BOMBARDMENT [J].
BALARIN, M ;
OTTO, G ;
STORBECK, I ;
SCHENK, M ;
WAGNER, H .
THIN SOLID FILMS, 1969, 4 (04) :255-&
[2]   SPECIAL ASPECTS OF DIFFUSION IN THIN-FILMS [J].
BALLUFFI, RW ;
BLAKELY, JM .
THIN SOLID FILMS, 1975, 25 (02) :363-392
[3]   SUPERIOR ALUMINUM FOR INTERCONNECTIONS OF INTEGRATED CIRCUITS [J].
BHATT, HJ .
APPLIED PHYSICS LETTERS, 1971, 19 (02) :30-&
[4]   ION-IMPLANTATION DAMAGE IN THIN METAL FILMS [J].
BOGARDUS, EH ;
HOWARD, JK ;
PERESSINI, P ;
PHILBRICK, JW .
APPLIED PHYSICS LETTERS, 1971, 18 (03) :77-+
[5]  
DHEURLE FM, 1977, 7TH P INT VAC C 3RD, P2123
[6]   F-19 RANGE-ENERGY CURVE IN SI FROM 100 TO 550 KEV [J].
DIETRICH, HB ;
PLEW, LE .
APPLIED PHYSICS LETTERS, 1976, 29 (07) :406-408
[7]   INFLUENCE OF ION-BOMBARDMENT ON PROPERTIES OF VACUUM-EVAPORATED THIN-FILMS [J].
DUDONIS, J ;
PRANEVICIUS, L .
THIN SOLID FILMS, 1976, 36 (01) :117-120
[8]   INTERFACIAL FREE ENERGY OF COHERENT TWIN BOUNDARIES IN COPPER [J].
FULLMAN, RL .
JOURNAL OF APPLIED PHYSICS, 1951, 22 (04) :448-455
[9]   STRESS-ENHANCED DIFFUSION IN THIN FILMS [J].
GANGULEE, A .
PHILOSOPHICAL MAGAZINE, 1970, 22 (178) :865-&
[10]   STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES [J].
GANGULEE, A .
ACTA METALLURGICA, 1974, 22 (02) :177-183