COMPARISON OF VACUUM-EVAPORATED AND ION-PLATED THIN-FILMS USING AUGER-ELECTRON SPECTROSCOPY

被引：15

作者：

WALLS, JM ^{[1
]}

HALL, DD ^{[1
]}

TEER, DG ^{[1
]}

DELCEA, BL ^{[1
]}

机构：

[1] UNIV SALFORD,DEPT AERONAUT & MECH ENGN,SALFORD M5 4WT,LANCASHIRE,ENGLAND

来源：

THIN SOLID FILMS | 1978年 / 54卷 / 03期

关键词：

D O I：

10.1016/0040-6090(78)90386-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Auger electron spectroscopy was used to study the interfaces for copper on nickel and for silver on nickel formed by vacuum evaporation and by ion plating. It was found that for copper on nickel, i.e. a soluble pair of materials, vacuum evaporation and ion plating produce interfaces of similar depths but for silver on nickel, an insoluble pair of materials, ion plating produces an interface significantly deeper than that produced by vacuum deposition. The interface produced by ion plating is thought to be due to implantation of the high energy depositing particles. © 1978.

引用

页码：303 / 308

页数：6

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