SHALLOW JUNCTION FORMATION BY BORON IMPLANTATION WITH ENERGIES BETWEEN 2 AND 5 KEV AND RAPID THERMAL ANNEALING

被引:8
作者
KAKOSCHKE, R [1 ]
EHINGER, K [1 ]
机构
[1] SIEMENS AG,ZTZFEME 41,D-8000 MUNCHEN 38,FED REP GER
关键词
D O I
10.1016/0168-583X(89)90306-6
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
引用
收藏
页码:823 / 827
页数:5
相关论文
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