FABRICATION OF SILICON OXYNITRIDE MASKS FOR X-RAY-LITHOGRAPHY

被引:9
作者
CSEPREGI, L
HEUBERGER, A
机构
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1979年 / 16卷 / 06期
关键词
D O I
10.1116/1.570366
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:1962 / 1964
页数:3
相关论文
共 12 条
[1]  
BASSOUS E, 1976, SOLID STATE TECHNOL, V9, P55
[2]   PROPERTY CHANGES IN PYROLYTIC SILICON NITRIDE WITH REACTANT COMPOSITION CHANGES [J].
DOO, VY ;
KERR, DR ;
NICHOLS, DR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1968, 115 (01) :61-&
[3]   STRESS IN ION-IMPLANTED CVD SI3N4 FILMS [J].
EERNISSE, EP .
JOURNAL OF APPLIED PHYSICS, 1977, 48 (08) :3337-3341
[4]   POLYIMIDE MEMBRANE X-RAY LITHOGRAPHY MASKS - FABRICATION AND DISTORTION MEASUREMENTS [J].
FLANDERS, DC ;
SMITH, HI .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (03) :995-997
[5]   PHYSICOCHEMICAL PROPERTIES OF CHEMICAL VAPOR-DEPOSITED SILICON OXYNITRIDE FROM A SIH4-CO2-NH3-H2 SYSTEM [J].
GAIND, AK ;
HEARN, EW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1978, 125 (01) :139-145
[6]   X-RAY LITHOGRAPHY .1. DESIGN CRITERIA FOR OPTIMIZING RESIST ENERGY-ABSORPTION .2. PATTERN REPLICATION WITH POLYMER MASKS [J].
GREENEICH, JS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1975, ED22 (07) :434-439
[7]   SILICON OXYNITRIDE FILMS FROM NO-NH3-SIH4 REACTION [J].
RAND, MJ ;
ROBERTS, JF .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (03) :446-453
[8]   THERMAL-STRESSES AND CRACKING RESISTANCE OF DIELECTRIC FILMS (SIN, SI3N4, AND SIO2) ON SI SUBSTRATES [J].
SINHA, AK ;
LEVINSTEIN, HJ ;
SMITH, TE .
JOURNAL OF APPLIED PHYSICS, 1978, 49 (04) :2423-2426
[9]   HIGH-RESOLUTION PATTERN REPLICATION USING SOFT X-RAYS [J].
SPEARS, DL ;
SMITH, HI .
ELECTRONICS LETTERS, 1972, 8 (04) :102-&
[10]  
SPEARS DL, 1972, SOLID STATE TECHNOL, V15, P21