INFLUENCE OF BIAS SPUTTER PARAMETERS ON THICK COPPER COATINGS DEPOSITED USING A HOLLOW-CATHODE

被引：66

作者：

THORNTON, JA ^{[1
]}

机构：

[1] TELIC CORP,SANTA MONICA,CA 90404

来源：

THIN SOLID FILMS | 1977年 / 40卷 / JAN期

关键词：

D O I：

10.1016/0040-6090(77)90135-3

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：335 / 344

页数：10

共 30 条

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