NONCONFORMAL AL VIA FILLING AND PLANARIZATION BY PARTIALLY IONIZED BEAM DEPOSITION FOR MULTILEVEL INTERCONNECTION

被引：18

作者：

MEI, SN

LU, TM

ROBERT, S

机构：

[1] RENSSELAER POLYTECH INST,DEPT PHYS,TROY,NY 12181

[2] IBM CORP,ESSEX JUNCTION,VT 05452

来源：

IEEE ELECTRON DEVICE LETTERS | 1987年 / 8卷 / 10期

关键词：

D O I：

10.1109/EDL.1987.26708

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：503 / 505

页数：3

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