The influence of the scattering processes on the mobility behavior in si MOSFETs operated from room to liquid helium temperatures is studied. In particular, the role of the Coulomb and surface roughness mechanisms owing to Fowler-Nordheim stress and bulk bias effects is underlined. This enables us to propose reliable mobility models applicable in the room, liquid nitrogen and liquid helium temperature ranges and to enlighten the physical parameters which are hidden behind the analytical models. This modeling is very useful for the simulation of the MOSFET electrical properties under room and cryogenic operations.