GROWTH-KINETICS OF TUNGSTEN MICROSTRUCTURES PRODUCED VIA THE HYDROGEN REDUCTION OF TUNGSTEN HEXAFLUORIDE ON LASER-HEATED SUBSTRATES

被引:16
作者
AUVERT, G
PAULEAU, Y
TONNEAU, D
机构
[1] ECOLE NATL SUPER ELECTROCHIM & ELECTROMET GRENOBLE,INST NATL POLYTECH GRENOBLE,F-38402 ST MARTIN DHERES,FRANCE
[2] SOC BERTIN,F-13762 LES MILLES,FRANCE
关键词
D O I
10.1063/1.350771
中图分类号
O59 [应用物理学];
学科分类号
摘要
Laser-assisted chemical vapor deposition of tungsten microstructures (dots, stripes, or films) has been accomplished via the H-2 reduction of WF6 on polycrystalline silicon-coated quartz substrates irradiated with a focused cw argon-ion laser beam. Tungsten dots were grown on the substrates via a pyrolytic process occurring within the laser-heated zone of about 200-mu-m in diameter. The morphology and height of these dots were determined as functions of deposition parameters by profilometer measurements. The effects of WF6 and H-2 partial pressures on the morphology and deposition rate of W dots were investigated at a laser-induced surface temperature ranging from 340 to 950-degrees-C. The deposition rate of flat-topped dots was independent of the deposition temperature and proportional to the WF6 partial pressure. The deposition rate of W dots with a Gaussian profile was independent of the WF6 partial pressure. At low temperatures (340-670-degrees-C) and high H-2 partial pressures (50-700 Torr), the deposition rate of Gaussian W dots was proportional to the square root of the H-2 partial pressure. At high temperatures (750-950-degrees-C) and reduced H-2 partial pressures (20-80 Torr), the deposition rate of these dots was proportional to the H-2 partial pressure. This reaction order equal to 1 was interpreted on the basis of the Rideal model involving a direct reaction between H-2 molecules and fluorinated adspecies on the W surface. The nature of the fluorinated adsorbed phase on the metal surface was discussed in terms of coordination number of W and F atoms. A new reaction mechanism for the H-2 reduction of WF6 promoted by laser irradiation of the deposition zone or accomplished in a conventional furnace-type reactor is discussed and proposed.
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页码:4533 / 4543
页数:11
相关论文
共 40 条
[1]  
ADAMS AE, 1984, LASER PROCESSING DIA, V39, P269
[2]   LASER CHEMICAL VAPOR-DEPOSITION OF SELECTED AREA FE AND W FILMS [J].
ALLEN, SD ;
TRINGUBO, AB .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (03) :1641-1643
[3]   REAL-TIME MEASUREMENT OF DEPOSITION INITIATION AND RATE IN LASER CHEMICAL VAPOR-DEPOSITION [J].
ALLEN, SD ;
JAN, RY ;
MAZUK, SM ;
VERNON, SD .
JOURNAL OF APPLIED PHYSICS, 1985, 58 (01) :327-331
[4]  
ALLEN SD, 1983, LASER DIAGNOSTICS PH, V17, P207
[5]   LOW-TEMPERATURE ION-BEAM ENHANCED ETCHING OF TUNGSTEN FILMS WITH XENON DIFLUORIDE [J].
BENSAOULA, A ;
IGNATIEV, A ;
STROZIER, J ;
WOLFE, JC .
APPLIED PHYSICS LETTERS, 1986, 49 (24) :1663-1664
[6]   ETCHING OF TUNGSTEN WITH XEF2 - AN X-RAY PHOTOELECTRON-SPECTROSCOPY STUDY [J].
BENSAOULA, A ;
GROSSMAN, E ;
IGNATIEV, A .
JOURNAL OF APPLIED PHYSICS, 1987, 62 (11) :4587-4590
[7]   ION ENHANCED REACTIVE ETCHING OF TUNGSTEN SINGLE-CRYSTALS AND FILMS WITH XEF2 [J].
BENSAOULA, A ;
STROZIER, JA ;
IGNATIEV, A ;
YU, J ;
WOLFE, JC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (04) :1921-1924
[8]  
BERG RS, 1973, CHEM VAPOR DEPOS, P196
[9]   VAPOR DEPOSITION OF TUNGSTEN BY HYDROGEN REDUCTION OF TUNGSTEN HEXAFLUORIDE - PROCESS VARIABLES AND PROPERTIES OF DEPOSIT [J].
BERKELEY, JF ;
BRENNER, A ;
REID, WE .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1967, 114 (06) :561-&
[10]  
Blewer R. S., 1986, Tungsten and Other Refractory Metals for VLSI Applications. Proceedings of the 1985 and 1984 Workshops, P53