FOCUSED-ION-BEAM CUTTER AND ATTACHER FOR MICROMACHINING AND DEVICE TRANSPLANTATION

被引：31

作者：

ISHITANI, T

OHNISHI, T

MADOKORO, Y

KAWANAMI, Y

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1991年 / 9卷 / 05期

关键词：

D O I：

10.1116/1.585661

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In focused-ion-beam (FIB) applications of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. The first and second processes play the role of "cutter" and the third and last processes play the role of "attacher". In this paper, the characteristics of FIB "cutter" and "attacher" are discussed using previously obtained feasibility experimental data and simple simulations.

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页码：2633 / 2637

页数：5

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