PROXIMITY EFFECT CORRECTION AT 10 KEV USING GHOST AND SIZING FOR 0.4-MU-M MASK LITHOGRAPHY

被引:6
作者
MURAY, A [1 ]
LOZES, RL [1 ]
MILNER, K [1 ]
HUGHES, G [1 ]
机构
[1] DUPONT PHOTOMASK,DANBURY,CT 06810
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1990年 / 8卷 / 06期
关键词
D O I
10.1116/1.585157
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An investigation of proximity effect correction at 10 keV using GHOST(TM) and sizing indicates 0.4 mu-m design targets can be achieved on a raster scan lithography system. It is shown through simulation and experiment that the proximity effect can be effectively eliminated by use of GHOST. Sizing provides an additional degree of freedom to control process latitude and wall angle.
引用
收藏
页码:1775 / 1779
页数:5
相关论文
共 10 条
[1]  
ADESIDA I, 1979, THESIS U C BERKELEY
[2]   PROXIMITY EFFECT IN ELECTRON-BEAM LITHOGRAPHY [J].
CHANG, THP .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1975, 12 (06) :1271-1275
[3]   GHOST PROXIMITY CORRECTION TECHNIQUE - ITS PARAMETERS, LIMITATIONS, AND PROCESS LATITUDE [J].
KOSTELAK, RL ;
KUNG, EH ;
THOMSON, MGR ;
VAIDYA, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (01) :448-455
[4]   EVALUATION OF THE PROXIMITY EFFECT AND GHOST CORRECTION TECHNIQUE FOR SUB-MICRON ELECTRON-BEAM LITHOGRAPHY AT 50 AND 20 KV [J].
KOSTELAK, RL ;
KUNG, EH ;
THOMSON, MGR ;
VAIDYA, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1988, 6 (06) :2042-2047
[5]  
LEEN TK, 1989, J APPL PHYS, V65, P448
[6]   ELECTRON-BEAM RESIST EDGE PROFILE SIMULATION [J].
NEUREUTHER, AR ;
KYSER, DF ;
TING, CH .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (04) :686-693
[7]   GENERAL SIMULATOR FOR VLSI LITHOGRAPHY AND ETCHING PROCESSES .1. APPLICATION TO PROJECTION LITHOGRAPHY [J].
OLDHAM, WG ;
NANDGAONKAR, SN ;
NEUREUTHER, AR ;
OTOOLE, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (04) :717-722
[8]   PROXIMITY EFFECT CORRECTION FOR ELECTRON-BEAM LITHOGRAPHY BY EQUALIZATION OF BACKGROUND DOSE [J].
OWEN, G ;
RISSMAN, P .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (06) :3573-3581
[9]   GHOST SOLUBILITY RATE RATIO - A NEW PARAMETER FOR CHARACTERIZATION OF POSITIVE ELECTRON RESISTS [J].
RISSMAN, P ;
OWEN, G .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1985, 3 (01) :159-164
[10]   THE USE OF BIAS IN ELECTRON-BEAM LITHOGRAPHY FOR IMPROVED PROFILE QUALITY AND LINEWIDTH CONTROL [J].
ROSENFIELD, MG ;
NEUREUTHER, AR ;
TING, CH .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1981, 19 (04) :1242-1247